Layer Count: Single – 42 layers
Laminate Types: FR-4 (140Tg, 170Tg, 180Tg) (all UL94V-0 rated), RF and Teflon, Arlon, Getek, Rogers, Nelco and more! Thermal materials including Laird, Arlon, Ventec, Iteq and Chin-Shi, bonded to Aluminum or Copper.
Laminate Thickness: 0.003" to 0.250"
Copper Weight: 1/2 ounce to 20 ounce, finished
Line & Space Widths: 0.003"/0.003"
In order to achieve this, it is all about control – Our quality control is made step by step, process by process, by our own people, from our first contact to point of delivery. As a customer to Master Print Elektronik you define what you need – we know how to achieve it.
Our capabilities always give our customers a competitive edge. By using the industry's most sophisticated and latest materials and processes, our customers' are assured the most reliable, state of the art products. These latest capabilities include:
1. Various unique materials including, Teflon, Flex, Rigid Flex, GETEK, Thermount, Rogers and other high performance materials
2. Via-in-pad technology which utilizes silver conductive and non-conductive fillers
3. In-house immersion silver plating process
4. In-house wire bondable NI/AU process
5. Fine line capabilities including, UL qualified .003" lines and space
| Specifications | Standard Technology | Advanced Technology |
| Number of Layers | 1-12 Layers | 14-42 |
| Board Material | Ventec VT-47 | Arlon Materials |
| Isola FR408 | Megtron 6 | |
| Iteq IT-180 | Mitsui | |
| DuPont Kapton | FR408 | |
| Rogers - 4000 Series | Getek | |
| Epoxy Adhesive System | Nelco 4000 Series | |
| DuPont FR & LF | Rogers 3000 Series | |
| Acrylic Adhesive System | Rogers 5000 Series | |
| DuPont AP | Rogers 6000 Series | |
| Adhesiveless System | Hitachi Theta | |
|
|
Taconic TLY | |
|
|
Polyimide | |
|
|
Mitsubishi BT | |
|
|
Berquest | |
|
|
Cobratherm | |
|
|
Flextherm | |
| Minimum Board Thickness | 2 layer - 0.010" | 2 layer - 0.005" |
| 4 layer - 0.020" | 4 layer - 0.010" | |
| 6 layer - 0.040" | 6 layer - 0.031" | |
| 8 layer - 0.062" | 8 layer - 0.040" | |
| 10 layer - 0.062" |
|
|
| 12 layer - 0.062" |
|
|
| Maximum Board Thickness | 2 layer - 0.125" | 0.250" - 0.325" |
| 3-12 layer - 0.200" | ||
| Maximum Board Size | 16.5" x 22.5" | 17.0" X 23.0" |
| Layer Count Rigid | 18 Layers | 36 Layers |
| Layer Count Flex | 6 Layers | 12 Layers |
| Layer Count Rigid Flex | 10 Layers | 18 Layers |
| Copper Thickness | 0.5 oz. - 3 oz. | 4 oz. - 7oz. |
| Hole Aspect Ratio | 10:01 | 15:01 |
| Minimum Hole Size | 0.008" | 0.005" |
| Mechanical Drill | 0.008" | 0.005" |
| Laser Drill | 0.004" | 0.003" |
| Minimum Trace/Space | 0.004"/0.004" | 0.002"/0.002" |
| Minimum Drill-to-Copper | 0.010" | 0.003" |
| Minimum Pitch | 0.004" | 0.002" |
| Final Finish | HASL | ENEPIG |
| Lead Free HASL | Wire BondableGold | |
| ENIG | Electroless Gold | |
| Hard Gold | Selective Gold | |
| Gold Fingers | Immersion Tin | |
| Immersion Silver |
|
|
| OSP |
|
|
| Solder Mask | LPI: | LPI: |
| Green | Yellow | |
| Black | White | |
| Red | Orange | |
| Blue | Purple | |
| Clear | Magenta | |
|
|
Dry Film | |
| Coverlay | FR Coverlay |
|
| LF Coverlay | ||
| Flexible Soldermask | ||
| Silk Screen | White | Green |
| Black | Red | |
| Yellow | Blue | |
| PCB Fabrication | Scoring | Jump Scoring |
| Route | Milling | |
|
|
Laser Rout | |
| Additional Features | Plated Slots | Plated Edges |
| Non-plated Slots | Plated Milling | |
| Controlled Dielectric | Plated Counter Bores & Counter Sinks | |
| Covered Vias | Edge Castellation | |
| Counter Sinks | Controlled Impedance | |
| Counter Bores | Silver Filled Vias | |
| Dual Access Flex | Non-Conductive Filled Vias | |
| Book Binder Flex | Copper Filled Vias | |
|
|
Plated Half Holes with clean edges | |
| Quality | IPC 6012 Class 1 & 2 | IPC 6012 Class 3 |
| IPC 6013 Class 1 & 2 | IPC 6013 Class 3 | |
|
|
ITAR | |
|
|
ISO 9001/2015 | |
|
|
100% Netlist Testing | |
|
|
TDR Testing | |
|
|
X-Ray Fluorescence | |
| Special Technology |
|
Blind & Buried Vias |
| Laser Drilled Vias | ||
| Stacked micro Vias | ||
| Copper Filled Vias | ||
| Metal Backed Boards | ||
| Rigid-Flex Boards | ||
| Flex Boards | ||
| Chip Modules | ||
| MILITARY SPECIFICATION PCB | Group A & B Certification | MI-P-55110 |
| MI-P-31032 |
Solder Mask over Bare Copper (SMOBC)
Solder Mask: LPI & SR1000
Carbon Ink
Gold Tab Plating
Electroless Nickel Immersion Gold (ENIG)
Lead-free HASL
OSP
Immersion Silver or Tin
Orbotech Genesis Software
Micro-modifications
Panel/ Array Optimization
Pre-manufacturing Design Checks
Artwork Generation from Bare Boards or Blueprints
Net List Test Fixture Generation
Copyright ©2021 Aspire Logic. Designed By Inck Technologies